公开(公告)号：US20240272556A1

公开(公告)日：2024-08-15

申请号：US18508171

申请日：2023-11-13

Applicant: SAMSUNG SDI CO., LTD.

Inventor： GyeongRyeong BAK ,  Hyungrang MOON ,  Ryunmin HEO ,  TaekSoo KWAK ,  Taegeun SEONG ,  ChungHeon LEE ,  Byeonggyu HWANG ,  Minsoo KIM

IPC: G03F7/32 ,  G03F7/16

CPC classification number: G03F7/32

Abstract: Disclosed are a metal-containing photoresist developer composition, and a method of forming patterns including a developing step utilizing the metal-containing photoresist developer composition. The metal-containing photoresist developer composition includes an organic solvent, an acid compound having 1.0≤pKa1≤4.8, and at least one alcohol-based compound selected from a diol compound derived from an acyclic hydrocarbon and a cyclic alcohol compound.