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公开(公告)号：US20240385515A1
公开(公告)日：2024-11-21
申请号：US18601843
申请日：2024-03-11
Applicant: SAMSUNG SDI CO., LTD.
Inventor： Gyeonghun PARK , Hyungrang MOON , Si-Kyun PARK , Taeksoo KWAK , Myoungsoo SONG , Donghyung LEE , Taewon BEOM , Donghoon SONG
Abstract: Provided is a method of forming patterns which includes coating a metal- containing resist composition on a substrate to form a resist layer; coating a composition for removing edge beads along edges of the substrate; performing drying and heat-treatment; and exposing and developing to form a resist pattern, wherein after the composition for removing edge beads is coated, a maximum hump height of the resist layer is less than or equal to about 300 nm in an area of about 1 mm to about 30 mm from the edges of the substrate toward a center of the substrate.
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公开(公告)号：US20240329536A1
公开(公告)日：2024-10-03
申请号：US18580110
申请日：2022-07-04
Applicant: SAMSUNG SDI CO., LTD.
Inventor： Hyungrang MOON , Minyoung LEE , Ryunmin HEO , Jamin KU , Donghyung LEE , Dasom HAN , Minsoo KIM , Jaehyun KIM
CPC classification number: G03F7/11 , G03F7/0042 , G03F7/161 , G03F7/168
Abstract: Provided are composition for removing edge beads from metal-containing resists, and a method of forming patterns including a step of removing edge beads using the same and the composition includes an organic solvent and a compound having an A log P3 of greater than or equal to 30 Å2.
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公开(公告)号：US20240369935A1
公开(公告)日：2024-11-07
申请号：US18565488
申请日：2022-07-04
Applicant: SAMSUNG SDI CO., LTD.
Inventor： Hyungrang MOON , Minyoung LEE , Ryunmin HEO , Jamin KU , Donghyung LEE , Dasom HAN , Minsoo KIM , Jaehyun KIM
Abstract: Provided are composition for removing edge beads from metal-containing resists, and a method of forming patterns including step of removing edge beads using the same and the composition includes an organic solvent and a compound having an AMW of 7 g/mol·ea or more.
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