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    Polyamide Ester Resin, Method for Preparing the Same, and Molded Article Including the Same
    1.
    发明申请
    Polyamide Ester Resin, Method for Preparing the Same, and Molded Article Including the Same 有权
    聚酰胺酯树脂，其制备方法和包含其的成型品

    公开(公告)号：US20160083509A1

    公开(公告)日：2016-03-24

    申请号：US14685927

    申请日：2015-04-14

    申请人： Samsung SDI Co., Ltd.

    发明人： Sang Kyun IM ,  Shin Hyo BAE ,  Su Yeong SON ,  Ki Yon LEE ,  So Young KWON ,  Joon Sung KIM ,  Jin Kyu KIM ,  Tae Joon PARK ,  Young Sub JIN

    IPC分类号： C08G63/60

    CPC分类号： C08G69/44

    摘要： A polyamide ester resin includes: a repeat unit derived from a dicarboxylic acid; a repeat unit derived from a diamine; and a repeat unit represented by the following Formula 1, wherein the polyamide ester resin has a melting temperature (Tm) of about 280° C. or more. The polyamide ester resin can exhibit excellent properties in terms of moisture absorption resistance, heat resistance, discoloration resistance, fluidity and the like by using a cyclic ester. wherein R1 is a C3 to C12 linear, branched or cyclic alkylene group.

    摘要翻译： 聚酰胺酯树脂包括：衍生自二羧酸的重复单元; 衍生自二胺的重复单元; 和由下式1表示的重复单元，其中聚酰胺酯树脂的熔融温度（Tm）为约280℃以上。 通过使用环状酯，聚酰胺酯树脂在耐吸湿性，耐热性，耐变色性，流动性等方面表现出优异的性能。 其中R1是C3-C12直链，支链或环状的亚烷基。

    Polyamide Resin, Method for Preparing the Same, and Molded Article Including the Same
    2.
    发明申请
    Polyamide Resin, Method for Preparing the Same, and Molded Article Including the Same 审中-公开
    聚酰胺树脂，其制备方法以及包含其的成型品

    公开(公告)号：US20160096924A1

    公开(公告)日：2016-04-07

    申请号：US14598506

    申请日：2015-01-16

    申请人： SAMSUNG SDI CO., LTD.

    发明人： Jin Kyu KIM ,  So Young KWON ,  Young Sub JIN ,  Joon Sung KIM ,  Su Yeong SON ,  Ki Yon LEE ,  Sang Kyun IM ,  Suk Min JUN

    IPC分类号： C08G69/30

    CPC分类号： C08G69/30 ,  C08G69/26

    摘要： A polyamide resin is a polymer of an adipic acid-containing dicarboxylic acid component and an m-xylenediamine-containing diamine component, wherein the polymer includes about 100 ppm or less of phosphorus and about 100 ppm or less of sodium (Na), and has a gel content of about 0.5% or less as measured on a specimen prepared by melting about 10 g of the polymer at about 260° C., maintaining the molten polymer for about 30 minutes, and then cooling the molten polymer to room temperature. The polyamide resin can exhibit excellent heat resistance and can reduce or prevent gel generation upon polymerization or molding.

    摘要翻译： 聚酰胺树脂是含己二酸的二羧酸成分和含有间二甲苯胺的二胺成分的聚合物，其中聚合物包含约100ppm以下的磷和约100ppm以下的钠（Na），并且具有 在通过在约260℃熔化约10g聚合物制备的样品上测量的凝胶含量为约0.5％或更低，保持熔融聚合物约30分钟，然后将熔融聚合物冷却至室温。 聚酰胺树脂可以表现出优异的耐热性，并且可以减少或防止聚合或模塑时的凝胶生成。