公开(公告)号：US20180162989A1

公开(公告)日：2018-06-14

申请号：US15747244

申请日：2016-08-01

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Doori SONG ,  Woo Han KIM ,  Dongju SHIN ,  Hong Jeong YU ,  Jiho LEE

IPC: C08G59/30 ,  C08G59/40 ,  C09D163/00 ,  H01L51/00 ,  H01L51/52

Abstract: Provided are a low temperature curing composition, a cured film obtained by curing the composition, and an electronic device comprising the cured film, wherein the composition comprises:(A) an epoxy group-containing siloxane compound represented by Chemical Formula 1: (R1R2R3SiO1/2)M(R4R5SiO2/2)D1(R6SiO3/2)T1(R7R8SiO2/2)D2(R9SiO3/2)T2   [Chemical Formula 1] (In Chemical Formula 1, each of R1 to R9 is an organic group independently selected from a substituted or unsubstituted monovalent aliphatic hydrocarbon group of C1 to C6, a substituted or unsubstituted monovalent cycloaliphatic hydrocarbon group of C6 to C20, a substituted or unsubstituted monovalent aromatic hydrocarbon group of C6 to C20, and an epoxy-substituted monovalent organic group, at least one of R1 to R6 is an epoxy-substituted monovalent organic group, 0≤M