公开(公告)号：US20190305482A1

公开(公告)日：2019-10-03

申请号：US16345316

申请日：2017-10-26

Applicant: SAMTEC INC.

Inventor： Jignesh SHAH ,  Jean Karlo WILLIAMS BARNETT ,  Eric ZBINDEN

IPC: H01R13/631 ,  H01R12/71 ,  H01R13/627 ,  G02B6/42

Abstract: An interconnect module, such as a transceiver is configured to mate with a host module that includes first and second electrical connectors. The interconnect module includes first and second pluralities of lands that are spaced from each other. The interconnect module can be mated with the host module such that the first lands mate with the first electrical connector, and the second lands mate with the second electrical connector. As the interconnect module is mated with the host module, the first lands can pass over mating regions of the electrical contacts of the second electrical connector without wiping against the mating regions. The interconnect module can be used in both front panel mount and mid board mount applications.