公开(公告)号：US20190304877A1

公开(公告)日：2019-10-03

申请号：US16461949

申请日：2017-11-17

Applicant: SAMTEC INC.

Inventor： Tim MOBLEY ,  Roupen Leon KEUSSEYAN

IPC: H01L23/48 ,  H01L23/498 ,  H01L23/15

Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

公开(公告)号：US20190326130A1

公开(公告)日：2019-10-24

申请号：US16461970

申请日：2017-11-17

Applicant: SAMTEC INC.

Inventor： Tim MOBLEY ,  Roupen Leon KEUSSEYAN

IPC: H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  H01L23/367

Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

公开(公告)号：US20190322572A1

公开(公告)日：2019-10-24

申请号：US16461998

申请日：2017-11-17

Applicant: SAMTEC INC.

Inventor： Tim MOBLEY ,  Roupen Leon KEUSSEYAN

IPC: C03C8/18 ,  H01B1/22 ,  H01L23/498 ,  C03C4/14 ,  C03C8/04

Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.