公开(公告)号：US20220103123A1

公开(公告)日：2022-03-31

申请号：US17483871

申请日：2021-09-24

Applicant: Seiko Epson Corporation

Inventor： Teppei HIGUCHI ,  Noboru ITOMI

IPC: H03B5/04 ,  H03B5/32 ,  H03K3/03

Abstract: A circuit device includes an oscillation circuit generating an oscillation signal by oscillating a vibrator, a temperature sensor circuit performing an intermittent operation, a logic circuit performing temperature compensation processing based on an output of the temperature sensor circuit, and a power supply circuit supplying power to the oscillation circuit. The oscillation circuit is disposed in a circuit region, the temperature sensor circuit and the logic circuit are disposed in a circuit region, and the power supply circuit is disposed in a circuit region, which is positioned between the circuit region and the circuit region.

公开(公告)号：US20220166379A1

公开(公告)日：2022-05-26

申请号：US17456396

申请日：2021-11-24

Applicant: Seiko Epson Corporation

Inventor： Noboru ITOMI

IPC: H03B5/04 ,  H03B5/32 ,  H03L1/02

Abstract: A vibration device includes a base including a semiconductor substrate and through electrodes that pass through the portion between first and second surfaces of the semiconductor substrate, and a vibrator fixed to the first surface via an electrically conductive joining member. The following components are placed at the second surface: an oscillation circuit that is electrically coupled to the vibrator via the through electrodes and generates an oscillation signal by causing the vibrator to oscillate, a temperature sensor circuit, a temperature compensation circuit that performs temperature compensation on the oscillation signal, and an output buffer circuit that outputs a clock signal based on the oscillation signal. Dsx1

公开(公告)号：US20210057338A1

公开(公告)日：2021-02-25

申请号：US16999200

申请日：2020-08-21

Applicant: Seiko Epson Corporation

Inventor： Noboru ITOMI

IPC: H01L23/522 ,  H01L23/528 ,  H01L23/552

Abstract: A semiconductor device includes a first high resistance pattern and a second high resistance pattern that are disposed along an X axis and are separated from each other, a coupling pattern that couples the first high resistance pattern and the second high resistance pattern, and a signal wiring disposed at a layer above the first high resistance pattern, the second high resistance pattern, and the coupling pattern. The coupling pattern includes a first portion that overlaps an end portion of the first high resistance pattern in a plan view at the layer above the first high resistance pattern, the coupling pattern includes a second portion that overlaps an end portion of the second high resistance pattern in a plan view at a layer above the second high resistance pattern, and the signal wiring is disposed along a Y axis that intersects the X axis in a plan view between an end of the coupling pattern at the first portion side and an end of the coupling pattern at the second portion side.

公开(公告)号：US20220166405A1

公开(公告)日：2022-05-26

申请号：US17456391

申请日：2021-11-24

Applicant: Seiko Epson Corporation

Inventor： Noboru ITOMI

IPC: H03H9/19 ,  H03H9/05 ,  H03H9/10 ,  H03H9/02 ,  H03H9/13

Abstract: A vibration device includes a base including a semiconductor substrate and a through electrode passing through the portion between a first surface and a second surface of the semiconductor substrate, a vibrator placed at the side facing the first surface, and an external connection terminal provided at the side facing the second surface via an insulating layer. An oscillation circuit that is electrically coupled to the vibrator via the through electrode and generates an oscillation signal by causing the vibrator to oscillate, and an output buffer circuit that outputs a clock signal based on the oscillation signal are placed at the second surface. The clock signal from the output buffer circuit is outputted via the external connection terminal. The through electrode and the external connection terminal are arranged so as not to overlap with each other in a plan view viewed in the direction perpendicular to the first surface.

公开(公告)号：US20160241190A1

公开(公告)日：2016-08-18

申请号：US15013314

申请日：2016-02-02

Applicant: SEIKO EPSON CORPORATION

Inventor： Yosuke ITASAKA ,  Noboru ITOMI

IPC: H03B5/36

CPC classification number: H03B5/364 ,  H03B5/04 ,  H03B5/36 ,  H03B5/362 ,  H03B2201/0208 ,  H03B2201/031

Abstract: An oscillation circuit includes a circuit for oscillation that oscillates a resonator, an output circuit that has a signal, output from the circuit for oscillation, input thereto to thereby output an oscillation signal, a connection terminal to which power is applied, a first wiring that connects from the connection terminal to the output circuit, and a second wiring that is connected to the first wiring through a connection node provided on the first wiring and connects from the connection node to the circuit for oscillation. The circuit for oscillation, the output circuit, the connection terminal, the first wiring, and the second wiring are provided on a semiconductor substrate. The length of a wiring extending from the connection terminal of the first wiring to the connection node is shorter than the length of the second wiring.

Abstract translation: 振荡电路包括用于振荡谐振器的振荡电路，具有从振荡电路输出的信号输出到输出振荡信号的输出电路，施加电源的连接端子，第一布线 从连接端子连接到输出电路，第二布线通过设置在第一布线上的连接节点连接到第一布线，并从连接节点连接到振荡电路。 用于振荡的电路，输出电路，连接端子，第一布线和第二布线设置在半导体基板上。 从第一布线的连接端子延伸到连接节点的布线的长度比第二布线的长度短。