公开(公告)号：US20250002667A1

公开(公告)日：2025-01-02

申请号：US18576584

申请日：2022-08-03

Applicant: SEKISUI CHEMICAL CO., LTD.

Inventor： Takeru KAWAKAMI ,  Tatsuya MATSUKUBO ,  Yusaku UCHIYAMA

IPC: C08J9/20 ,  C08J9/00 ,  C08J9/232

Abstract: The present invention provides a thermally expandable microcapsule from which a foam molded article that has a uniform surface, is less prone to surface unevenness, and has an excellently light weight can be produced. The present invention also provides a foamable masterbatch and a foam molded article each produced using the thermally expandable microcapsule. Provided is a thermally expandable microcapsule including: a shell; and a volatile expansion agent as a core agent encapsulated by the shell, the thermally expandable microcapsule satisfying D10/D50 of 0.6 or more and 1.0 or less and D99/D50 of 1.0 or more and 2.0 or less where D10 represents a particle size at a cumulative frequency of 10% by volume, D50 represents a particle size at a cumulative frequency of 50% by volume, and D99 represents a particle size at a cumulative frequency of 99% by volume in a cumulative undersize distribution of a volume-equivalent particle size determined using a laser diffraction/scattering particle size distribution analyzer.

公开(公告)号：US20220119614A1

公开(公告)日：2022-04-21

申请号：US17425835

申请日：2020-01-24

Applicant: SEKISUI CHEMICAL CO., LTD. ,  TOKUYAMA SEKISUI CO., LTD.

Inventor： Yasuhiro KAWAGUCHI ,  Takeru KAWAKAMI ,  Shun SATOU

IPC: C08J9/32 ,  C08K3/36 ,  C08F220/48 ,  C08J9/14 ,  C08J9/20 ,  C08L27/06 ,  C08J9/10

Abstract: The present invention provides a thermally expandable microcapsule having excellent heat resistance and high expansion ratio and enabling production of a light, high-hardness molded article having excellent physical properties (abrasion resistance), and a composition for foam molding containing the thermally expandable microcapsule. Provided is a thermally expandable microcapsule including: a shell containing a polymer; and a volatile expansion agent as a core agent encapsulated by the shell, the shell containing silicon dioxide and a polymer obtained by polymerizing a monomer composition containing a carbonyl group-containing monomer, the thermally expandable microcapsule having a ratio of a peak intensity based on a C═O bond in the shell to a peak intensity based on the silicon dioxide in the shell (peak intensity based on C═O bond/peak intensity based on silicon dioxide) of 0.25 to 1.0 as determined by IR spectral analysis, the thermally expandable microcapsule having a maximum foaming temperature (Tmax) of 180° C. to 225° C.