公开(公告)号：US20240326176A1

公开(公告)日：2024-10-03

申请号：US18712945

申请日：2022-12-01

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Yasuhisa SUKAWA ,  Hiroyuki YAMASAKI ,  Haruya SAKUMA ,  Masato SHIRATORI

IPC: B23K35/36 ,  B23K1/20

CPC classification number: B23K35/3612 ,  H05K3/3489

Abstract: A flux containing a rosin (P), a compound (SA), an activator (provided that a compound corresponding to the compound (SA) is excluded), and a solvent (provided that a compound corresponding to the compound (SA) is excluded) is adopted. The compound (SA) is a compound represented by General Formula (sa). In Formula (sa), R11 represents a hydrocarbon group which may have a hydroxy group. R12 and R13 each independently represent a hydrocarbon group having 5 or less carbon atoms, which may have a substituent, a hydroxy group, or a hydrogen atom. m represents a positive integer.

公开(公告)号：US20230158614A1

公开(公告)日：2023-05-25

申请号：US17787797

申请日：2021-10-13

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Toshihiko ORUI ,  Hiroaki HANDA ,  Hiroyuki YAMASAKI

IPC: B23K35/36 ,  B23K35/362

CPC classification number: B23K35/3612 ,  B23K35/362

Abstract: An objective of the present invention is to provide a flux that suppresses occurrence of flux drying up during soldering and occurrence of precipitation during storing.
The flux comprising, based on the whole flux,



3.5 to 11% by mass of a rosin ester,
more than 0% by mass and 18% by mass or less of a rosin resin other than a rosin ester, and
70% by mass or more and less than 96.5% by mass of a solvent.

公开(公告)号：US20190358754A1

公开(公告)日：2019-11-28

申请号：US16306858

申请日：2018-04-04

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Hiroyuki YAMASAKI ,  Takashi HAGIWARA ,  Hiroyoshi KAWASAKI

IPC: B23K35/362 ,  C08K5/17 ,  C08K5/5317 ,  C08K5/5313

Abstract: An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux.The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.