公开(公告)号：US20230059535A1

公开(公告)日：2023-02-23

申请号：US17382806

申请日：2022-10-07

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： WEN-CHIEH TSOU ,  YI-HUA CHANG

IPC: H01L31/167 ,  H01L25/16 ,  H01L31/0203

Abstract: A complex sensing device packaging structure and packaging method are disclosed. The packaging structure includes a substrate disposed with a light emitting element and a light sensing chip. A first non-transparent material is disposed on the light sensing chip. A transparent molding material surrounds the light emitting element, the light sensing chip and the first non-transparent material. A second non-transparent material is disposed inside the transparent molding material, and the second non-transparent material is connected with the first non-transparent material

公开(公告)号：US20220140172A1

公开(公告)日：2022-05-05

申请号：US17212362

申请日：2021-03-25

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： WEN-CHIEH TSOU ,  YI-HUA CHANG

IPC: H01L31/12 ,  H01L27/146 ,  H01L33/62 ,  H01L23/552

Abstract: A light sensing packaging structure and a packaging method thereof is provided, wherein the light sensing packaging structure comprises a substrate provided with a through-hole between a light-emitting element and a light-sensing element; and a cover body covered the substrate. The cover body comprises a shielding part and an extended part. The shielding part is mounted between the light-emitting element and the light-sensing element, and provided with a metal bonding layer on a surface towards the substrate. The extended part is provided with a metal side wall connected to the metal bonding layer. The through-hole is covered with a conductive glue, and the metal junction contacts the conductive glue. Hereby, the present application may reduce the size of the light sensing device, provide a stable packaging, reduce the packaging cost and improve the reliability of the light sensing product.