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公开(公告)号：US12218293B2
公开(公告)日：2025-02-04
申请号：US17666202
申请日：2022-02-07
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Junhong Min , Ik Kyu You
IPC: H01L33/58 , H01L25/075
Abstract: A pixel module includes a circuit board, a plurality of unit pixels arranged on the circuit board, and a molding member covering the plurality of unit pixels. The molding member includes a light diffusion layer and a black molding layer covering the light diffusion layer.
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