公开(公告)号：US09177700B2

公开(公告)日：2015-11-03

申请号：US14021960

申请日：2013-09-09

申请人： SH COPPER PRODUCTS CO., LTD.

发明人： Yoshihide Wadayama ,  Katsumi Ohata ,  Kazuhiko Nakagawa ,  Morio Kimura

IPC分类号： H01B12/00 ,  H01F6/00 ,  H01L39/00 ,  H01B12/10 ,  H01L39/24 ,  H01F6/06

CPC分类号： H01B12/10 ,  H01F6/06 ,  H01L39/2409 ,  Y10T29/49014 ,  Y10T428/12646 ,  Y10T428/12903

摘要： A precursor for a Nb3Sn superconductor wire to be manufactured by the internal diffusion method, includes a plurality of Nb-based single core wires, each of which includes a Nb-based core coated with a Cu-based coating including a Cu-based matrix, a plurality of Sn-based single core wires, each of which includes a Sn-based core coated with a Cu-based coating including a Cu-based matrix; and a cylindrical diffusion barrier including Ta or Nb, in which the plurality of Nb-based single core wires and the plurality of Sn-based single core wires are regularly disposed, wherein the plurality of Nb-based single core wires include Nb-based single core wires having a Cu/Nb ratio of 0.4 or more, wherein the Cu/Nb ratio is a cross sectional area ratio of the Cu-based coating to the Nb-based core.

摘要翻译： 通过内部扩散法制造的Nb 3 Sn超导体线的前体包括多个Nb基单根芯线，其中每根芯线包括涂覆有包含Cu基基体的Cu基涂层的Nb基核， 多个Sn基单根芯线，其中每根芯线包括涂覆有包含Cu基基体的Cu基涂层的Sn基芯; 以及包括Ta或Nb的圆柱形扩散阻挡层，其中多个Nb基单芯线和多个Sn-基单芯线被规则地布置，其中多个Nb基单芯线包括Nb基单根芯线 Cu / Nb比为0.4以上的芯线，其中Cu / Nb比是Cu系涂层与Nb系芯的截面积比。