Preparation Method of Heat-Conducting Interface Material

    公开(公告)号:US20220184861A1

    公开(公告)日:2022-06-16

    申请号:US17604466

    申请日:2020-08-27

    发明人: Yong FAN Yadong CHENG

    摘要: The present application belongs to the field of heat conducting materials technology, and in particular, to a preparation method of a heat conducting interface material. The present application discloses a preparation method of a heat-conducting interface material, which comprises: S1, stirring and mixing; S2. orientation process: putting a mixed material obtained in the step S1 into a hydraulic injection extruder, spitting the material out through a needle nozzle and arranging the material neatly in a container in a strip shape, and after stacking the material to ½-¼ of a height of the container, vibrating the material in a vibrating compactor and repeatedly performing stacking 2-4 times; S3, vacuum compaction; S4. curing; S5. slicing.