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公开(公告)号:US10913731B2
公开(公告)日:2021-02-09
申请号:US16756576
申请日:2018-10-15
发明人: Kazunori Aoki , Naoto Okumura , Takashi Kashiwabara , Yusuke Araki , Akihito Otsuka , Takeshi Kumano
IPC分类号: C07D407/14 , C08G59/24 , C08G65/18
摘要: The purpose of the present invention is to provide: a novel curable compound which can be expected to be used as a raw material for photocurable resins and thermosetting resins; a method for synthesizing said compound; a resin composition containing said compound; and a cured product thereof. This compound is an epoxy-oxetane compound represented by a formula, and this compound has a structure in which two epoxycyclohexyl groups (groups in which an oxirane ring and a cyclohexane ring are condensed) are bonded to an oxetane ring via a connector having one ether bond. In formula (I′), R1 to R3 may be the same as, or different from, each other, and each denote a hydrogen atom or a methyl group. n is 1 or 2.