专利检索 ap:("SHOWA DENKO MATERIALS CO., LTD.") AND inv:"Yuji HASHIBA" 第 1 页

1.

发明申请
LEAD-FREE LOW-MELTING GLASS COMPOSITION AND LOW-MELTING GLASS COMPOSITE MATERIAL AND LOW-MELTING GLASS PASTE CONTAINING LEAD-FREE LOW-MELTING GLASS COMPOSITION, AND SEALING STRUCTURE, ELECTRICAL AND ELECTRONIC PART AND COATED PART USING SAME 有权

公开(公告)号：US20220289621A1

公开(公告)日：2022-09-15

申请号：US17638308

申请日：2020-02-03

申请人： SHOWA DENKO MATERIALS CO., LTD.

发明人： Takashi NAITO , Shinichi TACHIZONO , Yuji HASHIBA , Tatsuya MIYAKE , Taigo ONODERA , Takuya AOYAGI

IPC分类号： C03C8/24 , C03C8/18 , C03C8/20 , H01L23/29 , H01L23/31

摘要： A lead-free low-melting glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, said composition satisfying the following two relational expressions (1) and (2) in terms of oxides. [Ag2O]≥[TeO2]≥[V2O5]≥[Li2O] (1) 2[V2O5]≥[Ag2O]+[Li2O]≥40 (2) (In the formula, [X] represents a content of component X, and the unit thereof is “mol %”; the same applies hereinafter.) Thus, it is possible to provide a lead-free low-melting glass composition which enables sealing and adhesion at around the melting point (232° C.) of tin and which has high adhesiveness and stickiness.