公开(公告)号：US20180197695A1

公开(公告)日：2018-07-12

申请号：US15741858

申请日：2016-05-19

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Karl-Heinz Schaller ,  Heinz Speil ,  Heinz Wöllmer

IPC: H01H11/04 ,  H01H1/02 ,  B22F7/08

CPC classification number: H01H11/048 ,  B22F7/08 ,  B22F2301/255 ,  H01H1/02 ,  H01H11/041 ,  H01H11/045 ,  H01H11/06 ,  H01H2201/024

Abstract: The disclosure relates to an electrical switching contact, including a contact carrier and a contact plating, which has a contact material, and to a method for producing the electrical switching contact. The disclosure is characterized in that a layer that may be sintered is arranged between the contact material and the contact carrier in order to connect the contact material to the contact carrier.

公开(公告)号：US20250104936A1

公开(公告)日：2025-03-27

申请号：US18728169

申请日：2022-11-03

Applicant: Siemens Aktiengesellschaft

Inventor： Akin Eymelli ,  Michael Jung ,  Christine Nitzbon ,  Heinz Speil

IPC: H01H11/06

Abstract: A contact carrier serves for fastening a contact element of a low-voltage protective switching device by a soldering operation, so that a solder layer is formed between the contact carrier and the contact element. The contact carrier has a contacting area for the solder layer, the contacting area for its part having a rough surface structure and being delimited by a first groove-like depression. As a result of the rough surface structure of the contacting area and the first groove-like depression, when the contact element is being fixed on the contact carrier by soldering, the solder flux can be specifically influenced to the effect that rising up of the solder at the sides of the contact element is avoided, or at least significantly reduced. The quality of the soldered connection, and consequently the reliability of the soldering process, are significantly improved in this way.