公开(公告)号：US20220392861A1

公开(公告)日：2022-12-08

申请号：US17369029

申请日：2021-07-07

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chi-Ren Chen ,  Po-Yung Chang ,  Pei-Geng Weng ,  Yuan-Hung Hsu ,  Chang-Fu Lin ,  Don-Son Jiang

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56

Abstract: An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.

公开(公告)号：US12027484B2

公开(公告)日：2024-07-02

申请号：US17369029

申请日：2021-07-07

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chi-Ren Chen ,  Po-Yung Chang ,  Pei-Geng Weng ,  Yuan-Hung Hsu ,  Chang-Fu Lin ,  Don-Son Jiang

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L24/14 ,  H01L21/56 ,  H01L23/31 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/562

Abstract: An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.

公开(公告)号：US12255165B2

公开(公告)日：2025-03-18

申请号：US18602396

申请日：2024-03-12

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chi-Ren Chen ,  Po-Yung Chang ,  Pei-Geng Weng ,  Yuan-Hung Hsu ,  Chang-Fu Lin ,  Don-Son Jiang

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.

公开(公告)号：US20240321798A1

公开(公告)日：2024-09-26

申请号：US18602396

申请日：2024-03-12

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chi-Ren Chen ,  Po-Yung Chang ,  Pei-Geng Weng ,  Yuan-Hung Hsu ,  Chang-Fu Lin ,  Don-Son Jiang

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L24/14 ,  H01L21/56 ,  H01L23/31 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/562

Abstract: An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.