公开(公告)号：US20220336398A1

公开(公告)日：2022-10-20

申请号：US17714445

申请日：2022-04-06

Applicant: SITRONIX TECHNOLOGY CORP.

Inventor： Kuo-Wei TSENG ,  Po-Chi CHEN

IPC: H01L23/00

Abstract: The present invention provides a bump structure of chip disposed on a surface of a chip and comprises a plurality of connecting-bump sets. Each connecting-bump set includes a first connecting hum and a second connecting hump. The first connecting bump and the second connecting bump include corresponding blocking structures. While disposing the chip on a board member, the blocking structure of the first connecting bump and the blocking structure of the second connecting bump block the conductive medium and retard the flow of the conductive medium. The conductive medium is forced to flow between the first connecting bump and the second connecting bump and thus preventing the conductive particles in the conductive medium from leaving the surfaces of the connecting bumps. In addition, there is a flow channel between the first and second connecting bumps. One or more width of the flow channel is between 0.1 μm and 8 μm.