公开(公告)号：US20190089044A1

公开(公告)日：2019-03-21

申请号：US16086333

申请日：2017-03-31

Applicant: SNAPTRACK, INC.

Inventor： Hisashi KOBUKE ,  Naoki SOTOMA ,  Yousuke FUTAMATA ,  Emi NINOMIYA ,  Atsushi ISHIMOTO

IPC: H01Q1/38 ,  H01L23/498 ,  H01L23/66 ,  H01L23/15 ,  H01L21/48 ,  H05K1/11 ,  H05K1/02 ,  H05K3/46 ,  H05K1/03 ,  H01Q9/04 ,  H01Q1/22

Abstract: [Problem] To realize high reliability and high functionalization while suppressing characteristics variation in a multilayer interconnection substrate used in a microwave or millimeter-wave band integrated with an antenna. [Resolution Means] A multilayer substrate for high frequency with an antenna element formed on a surface. The multilayer substrate for high frequency has an intermediate substrate. The intermediate substrate consists of a low-temperature co-fired glass-ceramic substrate and has intermediate insulating layers consisting of a glass-ceramic and an internal conductor formed between these intermediate insulating layers. A surface insulating layer consisting of an organic material having a dielectric constant lower than a glass-ceramic material is stacked on a surface of the intermediate substrate. An outer-side via conductor penetrating this surface insulating layer is configured by a sintered metal that forms a metallic bond with a wiring conductor in the substrate. The outer-side via conductor is formed at the same time as sintering the glass-ceramic multilayer substrate.