Abstract:
The invention relates to a method of characterizing an adhesive bond, the method comprising a step of recording an ultrasound wave reflected by an adhesive bond interface between two fragments, a step of resolving said wave into its sinusoidal components in order to characterize a mode of breaking to be expected in the event of the adhesive bonding interface breaking in shear.
Abstract:
A method of determining the breaking stress in shear for a part of determined thickness and made up of two elements that are bonded together by a layer of adhesive. A plane sensor emits an ultrasound wave at the part of determined thickness. The plane sensor receives a reflected signal made up of a plurality of successive echoes. A processor unit calculates a fast Fourier transform of the reflected signal. A Gaussian envelope connecting together the peaks of all of the resonances of the fast Fourier transform is determined. A frequency at which the Gaussian envelope is at a maximum is determined. The breaking stress from a predetermined correspondence relationship between the frequency of the maximum of the Gaussian envelope and the breaking stress is determined.