公开(公告)号：US20220240022A1

公开(公告)日：2022-07-28

申请号：US17596269

申请日：2020-06-16

Applicant: SONY GROUP CORPORATION

Inventor： TOSHIYUKI NAKAGAWA ,  YOSHIO OHASHI ,  JUNKO KATSURAKU ,  ASAMI YAMAGISHI

IPC: H04R17/00 ,  H04R7/10 ,  H04R1/02

Abstract: An audio reproducing apparatus that includes an audio device including a thin film material including a first electrode layer, a second electrode layer, and a capacitive layer sandwiched between the first electrode layer and the second electrode layer, the audio device having a three-dimensional shape formed by providing the thin film material with a plurality of fold parts.