公开(公告)号：US20250054925A1

公开(公告)日：2025-02-13

申请号：US18749657

申请日：2024-06-21

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongHyuk JEONG ,  DaAe LEE ,  EunByeol SON

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

Abstract: A semiconductor package is provided, comprising: a package substrate; a first plurality of semiconductor dice disposed on a front side of the package substrate; an embedded sub-package disposed on a back side of the package substrate, comprising: a sub-package substrate, wherein a front side of the sub-package substrate is attached to the back side of the package substrate; an interconnection layer attached to a back side of the sub-package substrate, comprising a second plurality of vertical interconnection portions and at least one horizontal interconnection portion; and a second plurality of semiconductor dice disposed on the back side of the sub-package substrate through the interconnection layer; and a first plurality of vertical interconnection portions disposed on the back side of the package substrate; and solder bumps attached to the first plurality of vertical interconnection portions.