公开(公告)号：US20240347373A1

公开(公告)日：2024-10-17

申请号：US18636304

申请日：2024-04-16

申请人： STATS ChipPAC Pte. Ltd.

发明人： JongChan PARK ,  YoungMin KIM ,  GilHo LEE ,  HyeongKwan KIM ,  TaeKeun LEE

IPC分类号： H01L21/687 ,  H01L21/68

CPC分类号： H01L21/68785 ,  H01L21/68

摘要： A device for holding a package substrate is provided. The device comprises: a lower jig comprising a base material, and magnets embedded within the base material; and an upper jig comprising a frame and a grid pattern inside the frame, wherein the frame has a skirt portion that defines a gap between the lower jig and the grid pattern to accommodate the package substrate, and wherein the grid pattern is attractable by the magnets such that when the upper jig is placed on the lower jig to accommodate the package substrate the grid pattern is in contact with the package substrate to apply a pressure to the package substrate due to a magnetic interaction between the magnets and the grid pattern.