公开(公告)号：US20250125289A1

公开(公告)日：2025-04-17

申请号：US18827895

申请日：2024-09-09

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： KaiChong CHAN ,  PeiEe Linda CHUA ,  Yaojian LIN

IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: An integrated package and a method for making the same are provided. The integrated package includes: an antenna module including: an antenna module substrate; and a top antenna structure disposed on the antenna module substrate; a first encapsulant encapsulating the antenna module; a first redistribution structure disposed on a bottom surface of the first encapsulant, wherein the first redistribution structure includes a bottom antenna structure configured for coupling electromagnetic energy with the top antenna structure; and a semiconductor chip mounted on a bottom surface of the first redistribution structure and electrically coupled with the bottom antenna structure.