公开(公告)号：US20210278202A1

公开(公告)日：2021-09-09

申请号：US17322225

申请日：2021-05-17

Applicant: STEPAN COMPANY

Inventor： Thomas K. Johnson, JR. ,  David J. Norberg ,  Daniel Yocius

IPC: G01B11/25 ,  B29C44/60 ,  G01B11/06 ,  G01B11/22 ,  G01B11/30 ,  G01B17/08

Abstract: Methods and systems for determining the integrity of a manufactured board are disclosed. An example system includes a testing platform configured to secure the manufactured board, a sensor configured to measure a parameter corresponding to a flatness of a surface of the board, and a controller. The controller is configured to identify regions on the surface corresponding to one of a peak or a valley based on the parameter, and calculate a score representing the integrity of the manufactured board based on the identified peaks and valleys. The controller adjusts a flow rate, a pressure, a temperature, and position of a deposited substance in a manufacturing process based on a comparison with a height of the peak and/or a depth of the valley to stored peak heights and/or valley depths. In some examples, a mechanical tester determines a compressive strength and a density of die board at the identified regions.