公开(公告)号：US10357964B2

公开(公告)日：2019-07-23

申请号：US15917231

申请日：2018-03-09

Applicant: STMICROELECTRONICS, INC. ,  STMICROELECTRONICS (MALTA) LTD

Inventor： Simon Dodd ,  Ivan Ellul ,  Christopher Brincat

IPC: B41J2/14 ,  B41J2/01 ,  B41J2/045

Abstract: One or more embodiments are directed to a microfluidic assembly that includes an interconnect substrate coupled to a microfluidic die. In one embodiment, the microfluidic die includes a ledge with a plurality of bond pads. The microfluidic assembly further includes an interconnect substrate having an end resting on the ledge proximate the bond pads. In another embodiment, the interconnect substrate abuts a side surface of the ledge or is located proximate the ledge. Conductive elements couple the microfluidic die to contacts of the interconnect substrate. Encapsulant is located over the conductive elements, the bond pads, the contacts.

公开(公告)号：US09950511B2

公开(公告)日：2018-04-24

申请号：US15277825

申请日：2016-09-27

Applicant: STMICROELECTRONICS, INC. ,  STMICROELECTRONICS (MALTA) LTD

Inventor： Simon Dodd ,  Ivan Ellul ,  Christopher Brincat

IPC: B41J2/14 ,  B41J2/01 ,  B41J2/045

CPC classification number: B41J2/01 ,  B41J2/04548 ,  B41J2/14072 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2002/14362 ,  B41J2002/14491

Abstract: One or more embodiments are directed to a microfluidic assembly that includes an interconnect substrate coupled to a microfluidic die. In one embodiment, the microfluidic die includes a ledge with a plurality of bond pads. The microfluidic assembly further includes an interconnect substrate having an end resting on the ledge proximate the bond pads. In another embodiment, the interconnect substrate abuts a side surface of the ledge or is located proximate the ledge. Conductive elements couple the microfluidic die to contacts of the interconnect substrate. Encapsulant is located over the conductive elements, the bond pads, the contacts.