公开(公告)号：US20210305306A1

公开(公告)日：2021-09-30

申请号：US17211739

申请日：2021-03-24

Applicant: STMICROELECTRONICS (CROLLES 2) SAS

Inventor： Thierry BERGER ,  Marc NEYENS ,  Audrey Vandelle BERTHOUD ,  Marc GUILLERMET ,  Philippe BRUN

IPC: H01L27/146

Abstract: The present disclosure relates to a method for manufacturing a pixel by: depositing an insulating layer on an exposed face of an interconnect structure of an integrated circuit, the interconnect structure having a conductive element flush with said exposed face; etching an opening passing through the insulating layer to the conductive element; depositing an electrode layer on and in contact with the conductive element and the insulating layer; defining an electrode by removing, by etching, part of the electrode layer resting on the insulating layer; and depositing a film configured to convert photons into electron-hole pairs when a ray at an operating wavelength of the pixel reaches the pixel.