公开(公告)号：US20240413178A1

公开(公告)日：2024-12-12

申请号：US18674220

申请日：2024-05-24

Applicant: STMICROELECTRONICS INTERNATIONAL N.V.

Inventor： Rita KUO

IPC: H01L27/146 ,  H01L23/00

Abstract: A glassless wafer-level optical sensor semiconductor package is provided. A method of manufacturing a glassless wafer-level optical sensor package of an example includes: forming one or more dams at least partially surrounding one or more optical sensors on a wafer; supporting the wafer on a carrier substrate via the one or more dams; forming a wafer-level optical sensor integrated circuit for each of the one or more optical sensors on the wafer by: performing a through-silicon via process on the wafer; forming an isolation layer on the wafer; and performing a passivation operation on the wafer; removing the wafer from the carrier substrate; and singulating each wafer-level optical sensor integrated circuit.