公开(公告)号：US09768216B2

公开(公告)日：2017-09-19

申请号：US14535423

申请日：2014-11-07

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Dave Alexis Delacruz ,  David Gani

IPC: H01L27/146 ,  G03B17/02 ,  G03B29/00 ,  G03B3/10

CPC classification number: H01L27/14625 ,  G03B3/10 ,  G03B17/02 ,  G03B29/00 ,  H01L27/14618 ,  H01L27/14685

Abstract: An image sensor device may include an interconnect layer, an image sensor IC on the interconnect layer, and a barrel adjacent the interconnect layer and having first electrically conductive traces. The image sensor device may include a liquid crystal focus cell carried by the barrel and having cell layers, and second electrically conductive contacts. A pair of adjacent cell layers may have different widths. The image sensor device may include an electrically conductive adhesive body coupling at least one of the second electrically conductive contacts to a corresponding one of the first electrically conductive traces.