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公开(公告)号：US20180306656A1
公开(公告)日：2018-10-25
申请号：US15957819
申请日：2018-04-19
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Elio GUIDETTI , Mohammad ABBASI GAVARTI , Daniele CALTABIANO , Gabriele BERTAGNOLI
CPC classification number: G01L1/18 , G01L5/162 , G01L25/00 , G01M5/0041 , G01M5/0083
Abstract: A stress sensor formed by a membrane plate; a first bonding region arranged on top of the membrane plate; a cover plate arranged on top of the first bonding region, the first bonding region bonding the membrane plate to the cover plate; three-dimensional piezoresistive elements extending across the membrane plate that are embedded in the bonding layer; and planar piezoresistive elements that extend across the membrane plate and are surrounded by and separated from the bonding layer.
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