公开(公告)号：US10510941B2

公开(公告)日：2019-12-17

申请号：US14788743

申请日：2015-06-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giovanni Abagnale ,  Sebastiano Ravesi

IPC: H01L35/34 ,  H01L27/16

Abstract: An embodiment of a process for realizing a system for recovering heat is described, the process comprising the steps of: formation on a substrate of a plurality of L-shaped down metal structures; deposition of a dielectric layer on the substrate and the plurality of L-shaped down metal structures by using a screen printing approach; definition and opening in the dielectric layer of upper contacts and lower contacts of the L-shaped down metal structures; formation of a plurality of L-shaped up metal structures being connected to the plurality of L-shaped down metal structure in correspondence of the upper and lower contacts so as to form a plurality of serially connected thermocouples, each comprising at least one L-shaped down metal structure and at least one L-shaped up metal structure, being made of different metal materials and interconnected at a junction, the serially connected thermocouples thus realizing the system for recovering heat.

公开(公告)号：US11594667B2

公开(公告)日：2023-02-28

申请号：US16692861

申请日：2019-11-22

Applicant: STMicroelectronics S.r.l.

Inventor： Sebastiano Ravesi ,  Giovanni Abagnale

IPC: H01L35/34 ,  H01L27/16

Abstract: In one embodiment, a method includes forming a plurality of thermocouples coupled in series by forming first metal segments comprising a first metal, each of the first metal segments having a L-shape. The method further includes forming a plurality of deep openings to expose a first contact region of each of the first metal segments, and forming a plurality of shallow openings to expose a second contact region of each of the first metal segments. The method further includes forming second metal segments comprising a second metal over the dielectric layer. The second metal is a different type of metal than the first metal. Each of the second metal segments contacts one of the first contact region of the first metal segments through one of the plurality of deep openings and contacts one of the second contact region of the first metal segments through one of the plurality of shallow openings. The plurality of thermocouples is formed within a building component.

公开(公告)号：US20200161528A1

公开(公告)日：2020-05-21

申请号：US16692861

申请日：2019-11-22

Applicant: STMicroelectronics S.r.l.

Inventor： Sebastiano Ravesi ,  Giovanni Abagnale

IPC: H01L35/34 ,  H01L27/16

Abstract: In one embodiment, a method includes forming a plurality of thermocouples coupled in series by forming first metal segments comprising a first metal, each of the first metal segments having a L-shape. The method further includes forming a plurality of deep openings to expose a first contact region of each of the first metal segments, and forming a plurality of shallow openings to expose a second contact region of each of the first metal segments. The method further includes forming second metal segments comprising a second metal over the dielectric layer. The second metal is a different type of metal than the first metal. Each of the second metal segments contacts one of the first contact region of the first metal segments through one of the plurality of deep openings and contacts one of the second contact region of the first metal segments through one of the plurality of shallow openings. The plurality of thermocouples is formed within a building component.