公开(公告)号：US20150310326A1

公开(公告)日：2015-10-29

申请号：US14640215

申请日：2015-03-06

Applicant: STMICROELECTRONICS S.r.I.

Inventor： Giuliano FILPI ,  Antonio SISMUNDO

IPC: G06K19/077

CPC classification number: G06K19/07739

Abstract: An integrated circuit card includes a substrate and an integrated circuit carried by the substrate. A first sector is delimited by a first weakening line on the substrate, with the first sector being able to be separated from the substrate. A second sector is delimited by a second weakening line inside the first sector, with the second sector being able to be separated from the substrate and having the integrated circuit thereon. A disposable frame-piece is defined between the first and second weakening lines of the first and second sectors, and has a ring form. A breakage lug is arranged with respect to the disposable frame-piece to break the disposable frame-piece so that it is no longer intact, during separation of the second sector from the substrate.

Abstract translation: 集成电路卡包括基板和由基板承载的集成电路。 第一扇区由衬底上的第一弱化线限定，第一扇区能够与衬底分离。 第二扇区由第一扇区内的第二弱化线限定，第二扇区能够与衬底分离并且在其上具有集成电路。 一次性框架件限定在第一和第二扇区的第一和第二弱化线之间，并且具有环形。 相对于一次性框架件布置破损凸耳，以在第二扇区与基板分离期间破坏一次性框架件使得其不再完整。