公开(公告)号：US20190131481A1

公开(公告)日：2019-05-02

申请号：US16177667

申请日：2018-11-01

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Marie-Astrid PIN ,  Jegger PADERNILLA ,  Jean-Michel RIVIERE

IPC: H01L31/16

Abstract: An encapsulation cover for an electronic package is formed by a first cover body and a second cover body. The first and second cover bodies are assembled together by a bonding material. Frontal walls of the first and second cover bodies are superposed and include through-passages that facing one another and are provided with optical elements allowing light to pass through. At least one surface of the frontal walls of the first and second cover bodies includes void containing the bonding material.