TRANSISTOR STRUCTURE
    1.
    发明公开

    公开(公告)号:US20230387293A1

    公开(公告)日:2023-11-30

    申请号:US18228309

    申请日:2023-07-31

    CPC classification number: H01L29/7813 H01L29/4236 H01L29/66734

    Abstract: A transistor is disclosed. In an embodiment a transistor includes a first semiconductor region of a substrate, a first trench delimiting the first semiconductor region on a first side, a first electrically-conductive element located in the first trench, a channel area in contact with the first semiconductor region and a first area of contact with the first semiconductor region, wherein the channel area and the first area of contact are on the same surface side of the substrate.

    Transistor structure
    3.
    发明授权

    公开(公告)号:US11757032B2

    公开(公告)日:2023-09-12

    申请号:US16867225

    申请日:2020-05-05

    CPC classification number: H01L29/7813 H01L29/4236 H01L29/66734

    Abstract: A transistor is disclosed. In an embodiment a transistor includes a first semiconductor region of a substrate, a first trench delimiting the first semiconductor region on a first side, a first electrically-conductive element located in the first trench, a channel area in contact with the first semiconductor region and a first area of contact with the first semiconductor region, wherein the channel area and the first area of contact are on the same surface side of the substrate.

    TRANSISTOR STRUCTURE
    5.
    发明申请

    公开(公告)号:US20200381550A1

    公开(公告)日:2020-12-03

    申请号:US16867225

    申请日:2020-05-05

    Abstract: A transistor is disclosed. In an embodiment a transistor includes a first semiconductor region of a substrate, a first trench delimiting the first semiconductor region on a first side, a first electrically-conductive element located in the first trench, a channel area in contact with the first semiconductor region and a first area of contact with the first semiconductor region, wherein the channel area and the first area of contact are on the same surface side of the substrate.

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