公开(公告)号：US11798967B2

公开(公告)日：2023-10-24

申请号：US17495047

申请日：2021-10-06

申请人： STMicroelectronics Asia Pacific Pte Ltd ,  STMicroelectronics (Grenoble 2) SAS

发明人： How Yang Lim ,  Olivier Zanellato

IPC分类号： H01L27/146 ,  H01L23/31 ,  H01L23/00 ,  H04N23/55

CPC分类号： H01L27/14627 ,  H01L23/31 ,  H01L24/14 ,  H04N23/55

摘要： An integrated circuit package includes a support substrate having a front side and a back side and an optical integrated circuit die having a back side mounted to the front side of the support substrate and having a front side with an optical sensing circuit. A glass optical element die has a back side mounted to the front side of the optical integrated circuit die over the optical sensing circuit. The mounting of the glass optical element die is made by a layer of transparent adhesive which extends to the cover the optical sensing circuit and a portion of the front side of the optical integrated circuit die peripherally surrounding the optical sensing circuit. An encapsulation material body encapsulates the glass optical element die and the optical integrated circuit die.

公开(公告)号：US11862757B2

公开(公告)日：2024-01-02

申请号：US17485010

申请日：2021-09-24

申请人： STMICROELECTRONICS (GRENOBLE 2) SAS

发明人： Olivier Zanellato ,  Remi Brechignac ,  Jerome Lopez

IPC分类号： H01L33/48 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/00

CPC分类号： H01L33/483 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/005

摘要： The present description concerns a package for an electronic device. The package including a plate and a lateral wall, separated by a layer made of a bonding material and at least one region made of a material configured to form in the region an opening between the inside and the outside of the package when the package is heated.