公开(公告)号：US20250111186A1

公开(公告)日：2025-04-03

申请号：US18830236

申请日：2024-09-10

Applicant: STMicroelectronics International N.V.

Inventor： Antonio Sismundo ,  Giuliano Filpi ,  Antonio Amoroso ,  Massimo Sena

IPC: G06K19/077

Abstract: A dual interface laminated card having a stack of layers includes at least a first core plastic layer, a second core plastic layer disposed over the first core plastic layer, an antenna inlay disposed between the second core plastic layer and first core plastic layer, and a micromodule disposed over the second core plastic layer. The core plastic layers are recycled plastic layers comprising a major percentage, in particular at least 80%, of low surface energy plastic. The laminated card further comprises at least a first layer of polyurethane heat activatable glue, coupled to a side facing the antenna inlay of at least one of the first and second core plastic layers such that the antenna inlay and the at least one core plastic layer are bonded together.