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公开(公告)号：US20230047409A1
公开(公告)日：2023-02-16
申请号：US17401702
申请日：2021-08-13
Applicant: STMicroelectronics International N.V.
Inventor： Kamaldeep Bansal , Alok Kumar Mittal , Jitendra Jain
Abstract: A method to provision a node network including provisioning a first generation of nodes by a root node; and provisioning a second generation of nodes by the first generation of nodes. Wherein at least one node from the first generation of nodes or the second generation of nodes is provisioned simultaneously with at least one other node from the first generation of nodes or the second generation of nodes.
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