公开(公告)号：US20250002332A1

公开(公告)日：2025-01-02

申请号：US18745739

申请日：2024-06-17

Applicant: STMicroelectronics International N.V.

Inventor： Giorgio ALLEGATO ,  Paolo FERRARI ,  Laura OGGIONI

IPC: B81B7/02 ,  B81C3/00 ,  G01C19/5783 ,  G01L9/00

Abstract: Described herein is a microelectromechanical sensor device, comprising: a stack of a first die that integrates a pressure-detection structure and a second die that integrates an inertial detection structure, the first die constituting a cap for the inertial detection structure and being bonded to the second die so as to define a hermetic cavity. The first die has a first substrate, having a front surface and a rear surface that is bonded to said second die, a buried cavity being buried and entirely contained in the first substrate and being arranged in a position corresponding to the front surface, from which it is separated by a membrane. In particular, the aforesaid buried cavity is distinct and separate from the hermetic cavity.