公开(公告)号：US20240170446A1

公开(公告)日：2024-05-23

申请号：US18508071

申请日：2023-11-13

Applicant: STMicroelectronics International N.V.

Inventor： Sandrine LHOSTIS ,  Bassel AYOUB ,  Laurent FREY

IPC: H01L23/00

CPC classification number: H01L24/80 ,  H01L24/08 ,  H01L2224/08145 ,  H01L2224/80895 ,  H01L2224/80896

Abstract: The present description concerns a method of assembly of a first assembly layer comprising a first copper region at a first surface and of a second assembly layer comprising a second region made of oxide or of an oxidized metal at a second surface, wherein the first and second surfaces are assembled by means of a hybrid bonding such that the entire first copper region is placed into contact with the oxide or the oxidized metal of the second region.