公开(公告)号：US20040227068A1

公开(公告)日：2004-11-18

申请号：US10677850

申请日：2003-10-02

Applicant: STMicroelectronics Ltd.

Inventor： Jeffrey Raynor ,  Jean-Luc Jaffard

IPC: H01L027/00 ,  H01J005/02

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L31/18 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for attaching a sensor and a housing to opposite sides of a mounting substrate is provided. The sensor has a sensing face that includes a sensing area and at least one signal output contact thereon. The mounting substrate has a circuitry face and at least one signal input contact thereon. The mounting substrate also has an opening therethrough. The method includes positioning the sensing area over the opening so that the at least one signal output contact of the sensor makes contact with the at least one signal input contact of the mounting substrate. The mounting substrate receives the housing so that the housing and the sensor are in alignment.

Abstract translation: 提供了一种用于将传感器和壳体附接到安装基板的相对侧的方法。 传感器具有感测面，其包括感测区域和其上的至少一个信号输出接触。 安装基板具有电路面和其上的至少一个信号输入触点。 安装基板也具有穿过其中的开口。 该方法包括将感测区域定位在开口上，使得传感器的至少一个信号输出触点与安装基板的至少一个信号输入触点接触。 安装基板接收壳体，使得壳体和传感器对准。