-
公开(公告)号：US20160004029A1
公开(公告)日：2016-01-07
申请号：US14322054
申请日：2014-07-02
Applicant: STMicroelectronics Pte Ltd.
Inventor： Tin Tun
Abstract: A method of selectively bonding a component to a substrate prevents glue displacement onto neighboring components. The method entails shortening a section of the perimeter of a mount wall so that the foot of the mount wall contacts the glue without causing substantial displacement. A cure step hardens and holds the shortened foot of the mount wall in a stationary position, while providing a partial bond. Meanwhile the rest of the mount wall that is not located near contact pads on the substrate has a tall foot that extends to the surface of the substrate and is bonded in the usual way. By modifying the component, it is not necessary to modify either the chemistry of the epoxy or the epoxy dispense operation.
Abstract translation: 将组分选择性地粘合到基底上的方法防止了在相邻部件上的粘合剂移位。 该方法需要缩短安装壁的周长的一部分，使得安装壁的脚部接触胶水而不引起实质的位移。 固化步骤硬化并将固定壁的缩短的脚保持在静止位置，同时提供部分粘合。 同时，不位于衬底上的接触垫附近的安装壁的其余部分具有延伸到衬底的表面并以通常方式结合的高脚。 通过改变组分，不需要改变环氧化合物或环氧树脂分配操作。
-
公开(公告)号：US09638884B2
公开(公告)日：2017-05-02
申请号：US14322054
申请日：2014-07-02
Applicant: STMicroelectronics Pte Ltd.
Inventor： Tin Tun
IPC: G02B7/02
Abstract: A method of selectively bonding a component to a substrate prevents glue displacement onto neighboring components. The method entails shortening a section of the perimeter of a mount wall so that the foot of the mount wall contacts the glue without causing substantial displacement. A cure step hardens and holds the shortened foot of the mount wall in a stationary position, while providing a partial bond. Meanwhile the rest of the mount wall that is not located near contact pads on the substrate has a tall foot that extends to the surface of the substrate and is bonded in the usual way. By modifying the component, it is not necessary to modify either the chemistry of the epoxy or the epoxy dispense operation.
-
Search Results
2
records
(took 0.014 seconds)
