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公开(公告)号:US20020093120A1
公开(公告)日:2002-07-18
申请号:US10036335
申请日:2001-12-26
Applicant: STMicroelectronics S.r.I.
Inventor: Pierangelo Magni , Andrea Cigada
IPC: B29C033/00
CPC classification number: H01L21/565 , H01L2224/32225 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
Abstract: A method is for forming a plastic protective package for an electronic device integrated on a semiconductor and comprising an electronic circuit to be encapsulated in the protective package. The electronic device may be at least partially activated from outside of the protective package. The method may include providing a mold having a half-mold with an insert abutting towards the inside of the mold and an end having an element that can be elastically deformed to abut in pressing contact against at least one portion of the integrated circuit. The method may also include injecting a resin into the mold so that the protective package has a hole by the at least one portion of the electronic circuit.
Abstract translation: 一种用于形成用于集成在半导体上的电子器件的塑料保护封装件的方法,包括要封装在保护封装中的电子电路。 电子设备可以至少部分地从保护包装的外部激活。 该方法可以包括提供具有半模的模具,其具有与模具内部邻接的插入件,端部具有能够弹性变形以抵抗与集成电路的至少一部分压接的元件。 该方法还可以包括将树脂注入到模具中,使得保护包装件通过电子电路的至少一部分具有孔。