公开(公告)号：US08759149B2

公开(公告)日：2014-06-24

申请号：US14029437

申请日：2013-09-17

Applicant: STMicroelectronics S.r.I.

Inventor： Mark Andrew Shaw ,  Gianmarco Antonio Camillo

IPC: H01L21/00 ,  B81B7/00

CPC classification number: B81B7/0064 ,  B81B2201/0257 ,  B81C1/00333 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48464 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An encapsulated micro-electro-mechanical device, wherein a MEMS chip is encapsulated by a package formed by a first, a second, and a third substrates that are bonded together. The first substrate has a main surface bearing the MEMS chip, the second substrate is bonded to the first substrate and defines a chamber surrounding the MEMS chip, and the third substrate is bonded to the second substrate and upwardly closes the chamber. A grid or mesh structure of electrically conductive material is formed in or on the third substrate and overlies the MEMS chip; the second substrate has a conductive connection structure coating the walls of the chamber, and the first substrate incorporates an electrically conductive region, which forms, together with the conductive layer and the grid or mesh structure, a Faraday cage.

Abstract translation: 一种封装的微机电装置，其中MEMS芯片由通过第一，第二和第三基板形成的封装封装，所述第一，第二和第三基板被结合在一起。 第一基板具有承载MEMS芯片的主表面，第二基板结合到第一基板并且限定围绕MEMS芯片的腔室，并且第三基板结合到第二基板并向上关闭腔室。 在第三衬底中或第三衬底上形成导电材料的栅格或网状结构，并覆盖在MEMS芯片上; 第二基板具有涂覆室的壁的导电连接结构，并且第一基板包括与导电层和网格或网状结构一起形成法拉第笼的导电区域。