公开(公告)号：US11842954B2

公开(公告)日：2023-12-12

申请号：US17887838

申请日：2022-08-15

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Giovanni Ziglioli ,  Alberto Pintus ,  Pierangelo Magni

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49586 ,  H01L21/481 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/49506

Abstract: A plastic material substrate has a die mounting location for a semiconductor die. Metallic traces are formed on selected areas of the plastic material substrate, wherein the metallic traces provide electrically-conductive paths for coupling to the semiconductor die. The semiconductor die is attached onto the die mounting location. The semiconductor die attached onto the die mounting location is electrically bonded to selected ones of the metallic traces formed on the plastic material substrate. A package material is molded onto the semiconductor die attached onto the die mounting location.

公开(公告)号：US11552024B2

公开(公告)日：2023-01-10

申请号：US16990748

申请日：2020-08-11

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Giovanni Ziglioli ,  Alberto Pintus ,  Michele Derai ,  Pierangelo Magni

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/66 ,  H01L23/00

Abstract: A method of manufacturing semiconductor devices, such as integrated circuits includes arranging one or more semiconductor dice on a support surface. Laser direct structuring material is molded onto the support surface having the semiconductor die/dice arranged thereon. Laser beam processing is performed on the laser direct structuring material molded onto the support surface having the semiconductor die/dice arranged thereon to provide electrically conductive formations for the semiconductor die/dice arranged on the support surface. The semiconductor die/dice provided with the electrically-conductive formations are separated from the support surface.

公开(公告)号：US11417590B2

公开(公告)日：2022-08-16

申请号：US17108270

申请日：2020-12-01

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Giovanni Ziglioli ,  Alberto Pintus ,  Pierangelo Magni

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56

Abstract: A plastic material substrate has a die mounting location for a semiconductor die. Metallic traces are formed on selected areas of the plastic material substrate, wherein the metallic traces provide electrically-conductive paths for coupling to the semiconductor die. The semiconductor die is attached onto the die mounting location. The semiconductor die attached onto the die mounting location is electrically bonded to selected ones of the metallic traces formed on the plastic material substrate. A package material is molded onto the semiconductor die attached onto the die mounting location.