专利检索 ap:("STMicroelectronics S.r.l." OR "STMicroelectronics (Rousset) SAS") AND inv:"Felice Versiglia" 第 1 页

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发明申请
QUAD FLAT NO-LEAD PACKAGE 审中-公开

公开(公告)号：US20190131197A1

公开(公告)日：2019-05-02

申请号：US16169700

申请日：2018-10-24

申请人： STMicroelectronics S.r.l. , STMicroelectronics (Rousset) SAS

发明人： Felice Versiglia , Antoine Pavlin , Claudio Tagliapietra

IPC分类号： H01L23/31 , H01L23/495 , H01L23/00

摘要： An electronic circuit can include a semiconductor chip having a thickness smaller than 160 μm and a package with flush contacts having the chip encapsulated therein. In some cases, the chip takes up more than twenty-five percent of the surface area of the package. The package can be a quad flat no-lead (QFN) package.