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公开(公告)号：US10580957B2
公开(公告)日：2020-03-03
申请号：US15700591
申请日：2017-09-11
Applicant: SULFURSCIENCE TECHNOLOGY CO., LTD
Inventor： Zhen-Yu Juang , Ho-Wei Wang , Sung-Yen Wei
Abstract: A thermoelectric material structure includes a substrate, at least one spacing layer, and at least one two-dimensional (2D) material layer. The substrate has a surface. The 2D material layer and the spacing layer are overlapped and disposed on the surface of the substrate. The thermal conductivity of the 2D material layer along the direction perpendicular to the surface of the substrate is less than 10 W/mK.
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