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公开(公告)号：US20230387643A1
公开(公告)日：2023-11-30
申请号：US18200536
申请日：2023-05-22
Applicant: SUTENG INNOVATION TECHNOLOGY CO., LTD.
Inventor： Ying LIANG , Wenmin ZHU
CPC classification number: H01S3/0405 , H01S3/10038 , G01S7/4814
Abstract: This application discloses a laser emission module and a LIDAR. The laser emission module includes: a laser emitter, a heat conduction substrate including a first board surface, and a first support board including a third board surface facing toward the laser emitter. The first board surface is configured to connect the laser emitter. The third board surface has a mounting region. The heat conduction substrate corresponding to the mounting region is mounted on the first support board.
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