公开(公告)号：US20210132202A1

公开(公告)日：2021-05-06

申请号：US17081913

申请日：2020-10-27

Applicant: SZ DJI TECHNOLOGY CO., LTD.

Inventor： Xiang LIU ,  Xiaoping Hong ,  Guoguang Zheng ,  Huai Huang ,  Jiangbo Chen

IPC: G01S7/497 ,  G01S7/481 ,  G01S17/10 ,  G02B26/08 ,  H01S5/00 ,  H01S5/40

Abstract: Systems and techniques associated light detection and ranging (LIDAR) applications are described. In one representative aspect, techniques can be used to implement a packaged semi-conductive apparatus is disclosed. The apparatus includes a substrate; a diode die carried by the substrate and positioned to emit an electromagnetic energy beam; and a shell coupled to the substrate to enclose the diode die. The shell includes an opening or a transparent area to allow the electromagnetic energy beam emitted from the diode die to pass through the shell.