公开(公告)号：US11161733B2

公开(公告)日：2021-11-02

申请号：US16608270

申请日：2018-05-07

Applicant: Safran Colibrys SA

Inventor： Stephan Gonseth ,  Raphael Brisson ,  Jacques Moser

IPC: B81B7/00 ,  G01P15/00 ,  G01P15/08

Abstract: Accelerometer including a decoupling structure for fixing the accelerometer on a package and a MEMS sensor chip for measuring an acceleration. The chip is supported by the decoupling structure and includes a sensor wafer layer of a semiconductor material. The decoupling structure forms a bottom portion for fixing the decoupling structure on the package and a top portion fixed to the sensor wafer layer so that the chip is arranged above the decoupling structure. A width of the top portion in a planar direction is smaller than a width of the bottom portion and/or the sensor wafer layer in the planar direction. The decoupling structure is made of the same semiconductor material as the sensor wafer layer. The centre point of the top portion is arranged in a central region of the bottom portion. The chip includes a hermetically closed cavity which includes a seismic mass of the chip.

公开(公告)号：US20200180945A1

公开(公告)日：2020-06-11

申请号：US16608270

申请日：2018-05-07

Applicant: Safran Colibrys SA

Inventor： Stephan Gonseth ,  Raphael Brisson ,  Jacques Moser

IPC: B81B7/00 ,  G01P15/08

Abstract: Accelerometer including a decoupling structure for fixing the accelerometer on a package and a MEMS sensor chip for measuring an acceleration. The chip is supported by the decoupling structure and includes a sensor wafer layer of a semiconductor material. The decoupling structure forms a bottom portion for fixing the decoupling structure on the package and a top portion fixed to the sensor wafer layer so that the chip is arranged above the decoupling structure. A width of the top portion in a planar direction is smaller than a width of the bottom portion and/or the sensor wafer layer in the planar direction. The decoupling structure is made of the same semiconductor material as the sensor wafer layer. The centre point of the top portion is arranged in a central region of the bottom portion. The chip includes a hermetically closed cavity which includes a seismic mass of the chip.