-
公开(公告)号：US07018268B2
公开(公告)日：2006-03-28
申请号：US10249433
申请日：2003-04-08
IPC分类号： B24B49/00
CPC分类号： B24B37/30 , B23B31/307 , B23B2226/18 , H01L21/6838
摘要： The present invention provides an apparatus and method for protecting a work piece during surface processing. The apparatus employs a protective material to protect a wafer during backside grinding. The apparatus can further include a vacuum chuck that allows the passage of a vacuum signal, a frame holding the protective material, a frame holder to hold the frame, and a fastening arrangement to fasten the frame holder to the chuck adjacent a support surface. The method provided by the invention can include providing a vacuum chuck, placing a protective material in contact with the chuck, placing a wafer in contact with the protective material, applying a vacuum signal securing the wafer with the chuck, and grinding the backside surface of the wafer.
摘要翻译： 本发明提供了一种用于在表面处理期间保护工件的装置和方法。 该装置采用保护材料以在背面研磨期间保护晶片。 该装置还可以包括允许真空信号通过的真空吸盘，保持保护材料的框架，用于固定框架的框架保持架以及紧固装置，以将框架固定件紧固在支撑表面上。 本发明提供的方法可以包括提供真空卡盘，将保护材料放置在与卡盘接触的位置，使晶片与保护材料接触，施加一个真空信号，用固定夹头的晶片， 晶圆。
-
公开(公告)号：US07118446B2
公开(公告)日：2006-10-10
申请号：US10407833
申请日：2003-04-04
摘要： A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perform both edge and face grinding with a single grind spindle. A non-contact position sensor in a work spindle measures work spindle displacement during grinding and provides feedback to the grind spindle to regulate the force imparted on the work piece by the grind spindle. In variations, an abrasive wheel disposed radially with respect to an axis of spindle rotation is utilized to perform edge grinding of the work piece. In other variations cleaning, polishing and grinding are carried out in a single grinding assembly. In yet other variations, a wheel dressing apparatus is utilized to dress the wheel when one or more forces to maintain productivity of the grind wheel exceed a threhold.
摘要翻译： 一种用于成形工件的磨削组件，其包括一个或多个研磨主轴。 每个研磨主轴包括由单个主轴驱动器驱动的两个独立的砂轮。 研磨主轴水平平移，用单个研磨主轴进行边缘和面磨削。 工作主轴中的非接触位置传感器可测量研磨过程中的工作主轴位移，并向研磨主轴提供反馈，以调节由研磨主轴施加在工件上的力。 在变型中，利用相对于主轴旋转轴径向放置的砂轮来执行工件的边缘磨削。 在其他变型中，清洁，抛光和研磨在单个研磨组件中进行。 在另一些变型中，当用于保持研磨轮的生产率的一个或多个力超过最大限度时，使用轮子修整装置来修整车轮。
-
公开(公告)号：US07458878B2
公开(公告)日：2008-12-02
申请号：US11548213
申请日：2006-10-10
摘要： The present embodiments provide methods, systems and apparatuses for use in grinding work pieces, such as wafers. Some embodiments provide methods that position a grind spindle to contact a first grinding spindle to a face of a work piece, remove a portion of the face, and control the removing of the portion of the face according to a control algorithm. This control algorithm can comprise determining a force applied to the work piece during the removing of the portion of the face, adjusting a feed rate of the first grind spindle when the force applied to the work piece has a predefined relationship with a first threshold level; and dressing a portion of the first grinding portion when the force applied to the work piece has a predefined relationship with a second threshold level that is greater than the first threshold.
摘要翻译： 本实施例提供了用于研磨诸如晶片的工件的方法，系统和装置。 一些实施例提供了一种方法，其定位研磨主轴以使第一研磨主轴接触工件的表面，去除面部的一部分，并且根据控制算法控制面部的部分的移除。 该控制算法可以包括确定在去除面部的部分期间施加到工件的力，当施加到工件的力具有与第一阈值水平的预定关系时，调节第一研磨主轴的进给速度; 以及当施加到所述工件上的力具有与大于所述第一阈值的第二阈值水平的预定关系时，修整所述第一研磨部的一部分。
-
-
搜索结果
3 条记录 (耗时 0.013 秒)
